XsunX

Patent Pending High Density PECVD

New Plasma Approach:

• Uniformly excites high-density

plasma over large areas with

minimal ion bombardment

• Deposition rates potentially 10x

faster than present commercial

chemical vapor deposition

"CVD" equipment.

• Scaleable to large areas

As large as 3 meters by 3 meters

Current embodiment one meter

Ask about our package of benefits for early adopters!!!