Patent Pending High Density PECVD

New Plasma Approach:

•   Uniformly excites high-density
     plasma over large areas with
     minimal ion bombardment
•   Deposition rates potentially 10x
     faster than present commercial  
     chemical vapor deposition 
     "CVD" equipment.
•   Scaleable to large areas
     As large as 3 meters by 3 meters
     Current embodiment one meter

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